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DATA SHEET
Part No. Package Code No.
AN29000A
QFP056-9-1010B
SEMICONDUCTOR COMPANY MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Publication date: February 2005
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AN29000A Contents
Features ............................................................................................................................. 3 Applications ........................................................................................................................ 3 Package ............................................................................................................................ 3 Application Circuit ................................................................................................................ 4 Pin Descriptions ..................................................................................................................... 5 Absolute Maximum Ratings .................................................................................................... 6 Operating Supply Voltage Range ............................................................................................. 6
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AN29000A
AN29000A
Silicon Monolithic Bi - CMOS IC
Features
IF - AMP1, IF - AMP2, DET, NOISE-SQ, RSSI, DATA - AMP, BATT - LOW, COMPANDER, SP - AMP, Half-Mute, OSC, PRESCALER, PROGRAMMABLE - COUNTER, Pre - AMP, Vol Control, Power Down, Splatter - Filter
Applications
IC for Cordless Telephone ( IF + COMPANDER + PLL )
Package
Quad 56 pin Plastic Package
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AN29000A
Application Circuit
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AN29000A
Pin Descriptions
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 EN C-DET SF-OUT SFC2 SFC1 COMP-DC POFF MIC-OUT MIC-IN BREF PD-OUT VCC2 DOUT GND2 BTL SP-OUT SP-IN TXDET PE GND3 EXPOUT DIN EDET Pin Description Enable input COMP detection Splatter filter output External splatter filter COMP output COMP output VREF Power down input Microphone amp output Microphone amp input Audio system reference output Power down output VCC2 Data amp output Ground 2 SP amp output 1 SP amp output 2 SP amp input Half-mute detection ZAP write Ground 3 EXP output Data amp input EXP detection Pin No. 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 DET-IN IF2-OUT N-DET Pin Description FM detector input IFamp2 output Noise detection
RSSI-DET RSSI detection IF2-IN IF2-VREF IF1-OUT VCC1 IF1-IN GND1 RXVCC PDL RXGND FINR SIG-OUT Batt-Low VSS RX-PD PLLREG TX-PD TXVCC FINT TXGND OSCI OSCO1 OSCO2 DATA CLK IFamp2input IFamp2 VREF IFamp1 output VCC1 IFamp1 input Ground 1 RX-counter VCC BL, PD threshold selection RX-counter Gnd RX-counter input LD, RSSI, ND output Battery low output Logic Gnd RX-phase comparator output Logic power source output TX-phase comparator output TX-counter VCC TX-counter input TX-counter Gnd Crystal oscillator input Crystal oscillator output1 Crystal oscillator output2 Serial data input Clock input
PreAMP-OUT Pre-amp output PreAMP-IN DET-OUT NFIN NFOUT Pre-amp input FM detection output Noise filter input Noise filter output
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AN29000A
Absolute Maximum Ratings
No. 1 2 3 4 5 6 7 8 Parameter Storage temperature Operating ambient temperature Operating ambient atmospheric pressure Operating constant gravity Operating shock Supply voltage Supply current Power dissipation Symbol Tstg Topr Popr Gopr Sopr VCC1, VCC2, RxVCC, TxVCC ICC PD Rating -55 to +125 -20 to +75 1.013 x 105 0.61 x 105 Unit C C Pa m/S2 m/S2 V mA mW *2 *3 Note *1 *1
9 810 4 900 6.5 30 195
Note ) *1 : Ta = 25C except storage temperature and operating ambient temperature. *2 : Power supply terminal (VCC1 (pin 36) , VCC2 (pin 12) , RxVCC (pin 39) , TxVCC (pin 49) ) should be supplied with same supply voltage. *3 : ICC is define as total current consumption at above four power supply terminal.
Operating Supply Voltage Range
Operating supply voltage range VCC1, VCC2, RxVCC, TxVCC 2.7 V to 5.5 V
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Request for your special attention and precautions in using the technical information and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technical information described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical information as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.
2003 SEP

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